신소재공학과

Research Highlight

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A joint research team led by Prof. Sang Ouk Kim and Keon Jae Lee in the Department of Materials Science and Engineering at KAIST and Prof. Kwang Ho Kim at Pusan Nat. Univ., has developed a technique for fabricating semiconductors using camera flash.

 

This technology is capable of producing ultra-fine patterns on a wafer scale large area by irradiating a single flash with a 7-nanometer patterning technique for semiconductors. In the future, it is expected that it can be used for manufacturing high efficiency and highly integrated semiconductor devices.


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The research results, which was co-1st authored by Dr. Hyeong Min Jin, and Ph.D. student of Dae Yong Park, were published online at Advanced Materials in the August 21.

 

High-capacity, high-performance semiconductor devices are essential for artificial intelligence (AI), Internet of things (IoT), and big data. In order to produce such a next-generation highly integrated semiconductor device, it is essential to develop a lithography technique that forms an ultra-fine pattern.

 

Currently, related industries have mainly used conventional photolithography for small patterns. However, this technique has limitations in forming a pattern of sub-10 nm pattern.

 

Molecular assembly patterning technology using polymer has been in the spotlight as the next generation technology to replace photolithography because it is low in process cost and can easily form sub-10 nm patterns. However, since it generally takes a long time to heat treatment at high temperature or toxic solvent vapor treatment, mass production is difficult and commercialization has been limited.

 

The research team introduced camera flash that instantly emit strong light to solve this issues of polymer molecular assembly patterning. Using flash light, it can be possible to achieve a semiconductor pattern of 7 nanometers within 15 milliseconds (1 millisecond: 1/1000 second), which can generate high temperature of several hundred degree Celsius in a short time of several tens of milliseconds.


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The team have demonstrated that applying this technique to polymer molecular assembly allows a single flash of light to form molecular assembly patterns.


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The team also confirmed that it could be applied to polymer flexible substrates that could not be compatible at high temperatures process. It can be applied to the fabrication of next generation flexible semiconductor.

 

The researchers said the camera flash photo-thermal process is introduced into molecular assembly technology and this high-efficiency technology can accelerate the realization of molecular assembly semiconductor technology.

 

Prof. Sang Ouk Kim, who led the research, said “Despite the potential, molecular assembly semiconductor technology has remained a big challenge in improving process efficiency.”, “This technology will be a breakthrough solution for the practical use of molecular assembly-based semiconductors.”

No. Subject Author Date Views
Notice Professor Kim Sang Ouk of KAIST participated in editorship of GRAPHIN NEW MATERIALS ADMINI 2017.10.23 274
Notice Pd nanowire array-based ultra-fast hydrogen gas sensor by using engineered nanofiltration of metal-organic framework ADMINI 2017.09.27 544
» 7 nanometer Semiconductor Manufacturing Technology with Camera Flash ADMINI 2017.09.14 697
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Notice Making Graphene Using Laser-induced Phase Separation ADMINI 2016.12.07 3307
Notice Hyper-stretchable elastic piezoelectric energy harvester ADMINI 2015.04.29 8391
Notice “Nature Materials” News & Views wrote by Prof. Sang Ouk Kim admin 2015.02.17 10452
Notice Academic Achievements & Related Awards admin 2015.02.17 8098
Notice Best Paper Award at 2014 Pan Pacific Microelectronic Symposium admin 2015.02.17 7977
Notice The Way towards Commercialization of Highly Efficient Nanogenerator admin 2015.02.17 8175
Notice The First Demonstration of Self-powered Cardiac Pacemaker admin 2015.02.17 7880
21 Equipment Development: “Hu:u” -New Concept Indoor Environmental Gauge file admin 2015.02.17 5301
20 The Convergence New Technology Fair Silver Award file admin 2015.02.17 3560
19 Grand Prize at the Dow Chemical Korea Award 2014 file admin 2015.02.17 3577
18 Mobile Sensor Array Platform & its Circuit Development. file admin 2015.02.17 3678
17 Intel Best Paper Award at Electronic Components and Technology Conference file admin 2015.02.17 3674
16 Excellent Paper Award at the 2014 Conference on Next Generation Lithography file admin 2015.02.17 3797
15 One of 2013 KAIST Top 10 Representative R&D Outcomes. file admin 2015.02.17 3749
14 3D Free Standing Structure Made of Graphene. file admin 2015.02.17 3768
13 Seon-Jin Choi, Jinsup Lee Prize Winner at the “9th 1nside” Edge International Thesis Competition from Samsung Electro-mechanics. file admin 2015.02.17 3869