학과 정기 세미나 안내

■ 제 목:  Exascale 3D Heterogeneous Integration Technology for Multifunctional Converging Integrated Systems


■ 연 사:  이강욱 박사 (SK 하이닉스)  


■  일 시:  11월 13일(화) 16:00


■ 장 소:  응용공학동 (W1) 1층 영상강의실


 Host :  백경욱 교수  


 Abstract :  

Since CMOS device scaling has stalled, three-dimensional (3-D) integration allows extending Moore`s law to ever high density, higher functionality, higher performance, and more diverse materials and devices to be integrated with lower cost. 3-D integration has many benefits such as increased multi-functionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, because it vertically stacks multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip. Anticipated applications start with memory, handheld devices, and high-performance computers and especially extend to multifunctional convergence systems such as cloud networking, internet of things (IoT), big data server, electrical vehicle system, energy harvesting system and, wireless implantable medical system by flexible heterogeneous integrations involving CMOS, MEMS, sensors, battery, photonic circuits and so.

One of the important potential applications is a smart electrical system for future intelligent automotive. Large numbers and various kinds of LSIs and sensor devices such as radars, MEMS sensors, local area network, RF, microprocessor, memory and electronic control unit are loaded in an automotive to prevent abnormal accidents and to assist an autonomous driving. However, heterogeneous integration of different functional devices has many technical challenges owing to various types of size, thickness, and substrate of different functional devices, because they were fabricated by different technologies. Current standard 2D LSI technology cannot meet such requirements.

In the seminar, I will introduce couples of multifunctional converging integrated systems as potential applications and unique exascale 3D heterogeneous integration technologies developed by Tohoku University focusing  on a high speed sensing, highly parallel processing stereo vision 3D stacked image sensor module for autonomous driving assist in future automotive.