ㅇ 주제 : IBM-KAIST Joint Study Program on Pb-free Solder Science & Technology
ㅇ 연사 : 강성권 박사 (IBM T.J. Watson Research Center, NY, USA)
ㅇ 일시 : 2015. 10. 7 (수), 16:00-17:00
ㅇ 장소 : Education 3.0 강의실 (2427호)
ㅇ Abstract : The IBM-KAIST joint study program was established in 1995, well before the landmark Directive of RoHS (Restriction of Hazardous Substances) passed by the European Union in 2002. The RoHS became effective in 2006 to ban toxic materials (such as Pb, Hg, Cd, Cr, PBB, PBDE) used in electrical and electronic equipment to be sold in the EU.
The objective of the joint study program was to investigate the mechanical & physical properties of Pb-free solder joints applied for electronic packaging applications. This program has lasted more than 15 years until 2013, and significantly contributed to enhance our understandings on many important issues of Pb-free solder science and technology.
In this talk, several key findings are reviewed in the areas of interfacial reactions, oxidation, control of undercooling, minor alloying effects, electromigration, tin whiskers, and others.