■ 참가자 접속정보 (3:50분까지 참가를 부탁드립니다)   

      접속 링크: https://kaist.zoom.us/j/8080757553 

      ID: 808 075 7553

      비밀번호: 2021mse

■ Abstract :  

SAMSUNG Advanced Package FAB solutions provide complementary and extended solutions with complete supply chain management including Fanout WLP, Panel level PKG, 2.5D as well as 3D Integration. Currently higher computing power and memory bandwidth are the major requirements of Al and GPU, accelerators and network devices. These demands lead to the adoption of the advanced packaging technologies to increase bandwidth density, thermal performance and to improve electrical performance with shorter interconnection length. 3D TSV technologies provide high bandwidth density within a limited footprint. For HPC applications, 2.5D and 3D technologies are employed for cloud and artificial intelligence (AI). High-performance chip size continues to increase up to one reticle size and the cost of the leading-edge silicon node is recently soaring. So various chiplet packaging solutions, such as 2D, 2.5D and 3D are necessary to develop fine pitch interconnection evolutions with the Cu hybrid bonding or fine pitch microbump bonding process. In this presentation, the above mentioned advanced package FAB solutions are to be introduced and discussed in terms of challenges and opportunities for emerging high-end computing and mobile processor platforms. Furthermore, Fanout WLP, RDL interposer, high-performance 3D SIP.