신소재공학과

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Ji Won Shin, a doctoral graduate, receives Intel Best Student Paper Award from ECTC

 

Ji Won Shin, Ph.D graduate (Research advisor: Kyoung-Wook Paik) from the department of material science and engineering (MSE), KAIST is receiving 'Intel Best Student Paper Award' at Electronic Component and Technology Conference, ECTC 2015 (26th~29th May) which takes place in San Diego, USA.


Mr. Shin was recognized for the excellence in his research by the paper, 'A Novel Fine Pitch TSV Interconnection Method using NCF with Zn Nano Particles' which was co-researched with Samsung electronics.
Nano-packaging and Interconnect Laboratory (NPIL), advised by professor Kyoung-Wook Paik gained great reputation as a world-competitive electronic-packaging group from academies and industries by receiving the award for two consecutive years. 

 

ECTC is the premier international conference that brings together the best researchers and engineers in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. The conference is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of IEEE (Institute of Electrical and Electronics Engineering).

 

신지원 박사 졸업생, 전자부품기술학회 인텔 최우수 학생 논문상 수상

우리 학교 신소재공학과 졸업생 신지원 박사 ( 삼성전자, 지도교수 백경욱) 올해 5 26~29 미국 플로리다에서 열리는 세계 최대 규모의 전자부품기술학회 (ECTC, Electronic Components and Technology Conference)에서 인텔(Intel) 최우수 학생논문상을 받는다.

  씨는 지난해 5 미국 올란도에서 열린 전자부품기술학회에서 삼성전자와 공동으로 수행한아연 나노 입자가 함유된 비전도성 접착 필름을 사용한 미세피치 TSV 접합 방법 대한 연구결과를 발표해 우수성을 인정받았다.

 KAIST 신소재공학과 백경욱 교수 연구실에서 2 연속 ECTC 최우수 학생논문상을 배출, 연구결과를 세계적으로 인정받는 쾌거를 이뤘다고 국내 학계는 평가하고 있다.

 전자부품기술학회는 세계 전자 패키징 분야 산업체·대학·연구소에서 1,000여명이 참가해 관련 분야 최신 연구논문을 발표하는 세계 최대 학회다.

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